Ultra-Slim design, 0.4mm pitch, 0.8mm stack heigh.Stable Contact performance and a better feel for mating.

High Power up to 120A per pin; Low Power up to 30A per pin.            20.85mm board height, ideal for 1U/2U power and distribution systems.            High-airflow design for efficient heat dissipation and cooling.            Halogen-free material for environmental compliance.            Available in right-angle male and female versions.            Power and signal pin layout customizable per customer requirements.            Operating temperature: -40°C to +125°C for harsh environments.    

Comply with OCP M-CRPS specificationHigh-Power Capability: Supports up to 4500W (4 layers and 6oz copper for each layer)Multi-Contact Power Design: Enhances conductivity and reduces contact resistanceStable Signal Structure: Recessed terminal design prevents damage during matingEfficient Thermal Performance: Enhanced cooling design for superior heat dissipationHigh Assembly Accuracy: PIP-compatible design ensures precise PCB alignment

Pin count 20P through 120PSelf-Alignment MechanismFloating DesignDedicated Power pin/Ground pin design8Gbps NRZ/16Gbps PAM4100 Mating cycle

25% Higher Linear Current DensityUp to 3,000W at 12V with a Multi-Contact Design23% Size Reduction Compared to Traditional Card-Edge ConnectorsHigh-Airflow Design for Enhanced Heat Dissipation and Efficient System CoolingMid-Mount Design with a 5.335 mm Recess Height